XC7Z035-L2FBG676I

Applications

The XC7Z035-L2FBG676I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and advanced analytics platforms. This device supports a wide range of operating temperatures from -40°C to +85°C, making it suitable for various industrial settings.

Key Advantages

1. High clock speed up to 667 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR3L at speeds up to 1600 MHz, enhancing data throughput.

3. Low power consumption, achieving less than 1.5W at typical operating conditions.

4. Compliance with multiple industry certifications including CE, FCC, and RoHS.

Frequently Asked Questions

Q1: Can the XC7Z035-L2FBG676I be used in extreme temperature environments?

A1: Yes, it operates within a temperature range of -40°C to +85°C, making it suitable for harsh environments.

Q2: What are the compatibility requirements for this device?

A2: The XC7Z035-L2FBG676I is compatible with standard DDR3L memory modules and supports a variety of operating systems including Linux and Windows.

Q3: In which specific scenarios would you recommend using this XC7Z035-L2FBG676I?

A3: This device is recommended for applications requiring high-speed data processing and low-power operation, such as real-time signal processing and embedded systems in automotive and aerospace industries.

Other people’s search terms

– High-performance computing solutions

– DDR3L memory support

– Low-power FPGA devices

– Industrial-grade temperature range

– Advanced analytics platform components