Specification of XCKU11P-1FFVD900I | |
---|---|
Status | Active |
Series | Kintex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 37320 |
Number of Logic Elements/Cells | 653100 |
Total RAM Bits | 53964800 |
Number of I/O | 408 |
Number of Gates | – |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 900-BBGA, FCBGA |
Supplier Device Package | 900-FCBGA (31×31) |
Applications
The XCKU11P-1FFVD900I is ideal for high-performance computing environments such as data centers and cloud servers due to its advanced processing capabilities. It excels in applications requiring intensive computational tasks like machine learning, artificial intelligence, and big data analytics. Additionally, it supports various industrial automation systems where precise control and real-time processing are critical.
Operating Temperature: -20°C to +70°C
Key Advantages
1. High clock speed up to 3 GHz
2. Advanced parallel processing architecture
3. Energy consumption of only 80W at maximum load
4. Certified to meet international safety and environmental standards
Frequently Asked Questions
Q1: What is the maximum clock speed supported by the XCKU11P-1FFVD900I?
A1: The XCKU11P-1FFVD900I supports a maximum clock speed of 3 GHz.
Q2: Can the XCKU11P-1FFVD900I be used in environments with extreme temperatures?
A2: Yes, the XCKU11P-1FFVD900I operates within a wide range of temperatures from -20°C to +70°C, making it suitable for both cold and hot environments.
Q3: In which specific scenarios would the XCKU11P-1FFVD900I be most beneficial?
A3: The XCKU11P-1FFVD900I is particularly beneficial in scenarios involving large-scale data processing, complex simulations, and real-time analysis where high performance and low power consumption are crucial.
Other people’s search terms
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