XC6SLX150-3FGG900C

Applications

The XC6SLX150-3FGG900C is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and large-scale scientific simulations. This device supports operating temperatures ranging from -40°C to +85°C, making it suitable for various industrial settings.

Key Advantages

1. High clock speed up to 750 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.

3. Energy-efficient design with power consumption optimized for extended operation without overheating.

4. Compliance with multiple certification standards including CE, FCC, and RoHS, ensuring global market acceptance.

Frequently Asked Questions

Q1: Can the XC6SLX150-3FGG900C operate effectively in extreme temperatures?

A1: Yes, it operates within a wide range of temperatures (-40°C to +85°C), making it suitable for both cold and hot environments.

Q2: What are the specific memory configurations supported by the XC6SLX150-3FGG900C?

A2: The XC6SLX150-3FGG900C supports dual-channel DDR4 memory configurations with capacities up to 128 GB.

Q3: In which industries is the XC6SLX150-3FGG900C commonly used?

A3: Commonly used in telecommunications, automotive electronics, and aerospace sectors for their need for high-speed processing and reliability.

Other people’s search terms

– High-performance computing solutions

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– Certifications for industrial-grade FPGAs