Specification of XC7S75-2FGGA676I | |
---|---|
Status | Active |
Series | Spartan?-7 |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 6000 |
Number of Logic Elements/Cells | 76800 |
Total RAM Bits | 4331520 |
Number of I/O | 400 |
Number of Gates | – |
Voltage – Supply | 0.95V ~ 1.05V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 676-BGA |
Supplier Device Package | 676-FPBGA (27×27) |
Applications
The XC7S75-2FGGA676I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and artificial intelligence training models. This device supports a wide range of operating temperatures from -40°C to +85°C, ensuring reliability across various environmental conditions.
Key Advantages
1. High clock speed up to 200 MHz, providing fast processing performance.
2. Advanced memory interface supporting DDR4 RAM for enhanced data throughput.
3. Energy-efficient design with low power consumption per gigaflop.
4. Compliance with multiple industry certifications including ISO 9001 and CE marking.
Frequently Asked Questions
Q1: Can the XC7S75-2FGGA676I be used in extreme temperature environments?
A1: Yes, it operates within a temperature range of -40°C to +85°C, making it suitable for both cold and hot climates.
Q2: What kind of memory does the XC7S75-2FGGA676I support?
A2: The XC7S75-2FGGA676I supports DDR4 memory, which significantly boosts its data handling capacity.
Q3: In which specific scenarios would you recommend using the XC7S75-2FGGA676I?
A3: The XC7S75-2FGGA676I is recommended for scenarios requiring high-speed data processing and energy-efficient operation, such as real-time analytics and machine learning algorithms.
Other people’s search terms
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– Extreme temperature operation FPGAs