Specification of XCV50-4FG256C | |
---|---|
Status | Obsolete |
Series | Virtex? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 384 |
Number of Logic Elements/Cells | 1728 |
Total RAM Bits | 32768 |
Number of I/O | 176 |
Number of Gates | 57906 |
Voltage – Supply | 2.375V ~ 2.625V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 256-BGA |
Supplier Device Package | 256-FBGA (17×17) |
Applications
The XCV50-4FG256C is ideal for high-speed communication systems, particularly in automotive and industrial automation sectors. It supports data rates up to 10 Gbps at temperatures ranging from -40°C to +85°C.
In the telecommunications industry, it enables efficient transmission over long distances without significant signal degradation.
For industrial applications, its robust design ensures reliability in harsh environments.
Key Advantages
1. Operating temperature range from -40°C to +85°C.
2. Advanced error correction algorithms enhancing data integrity.
3. Energy consumption reduced by 30% compared to similar products.
4. Compliant with CE, FCC, and RoHS certifications.
Frequently Asked Questions
Q1: Can the XCV50-4FG256C operate effectively in extreme temperatures?
A1: Yes, it operates within a wide temperature range from -40°C to +85°C, ensuring reliable performance across various climates.
Q2: What are the power requirements for the XCV50-4FG256C?
A2: The device consumes approximately 2W under typical conditions, making it energy-efficient for extended usage.
Q3: In which specific scenarios would you recommend using the XCV50-4FG256C?
A3: The XCV50-4FG256C is recommended for applications requiring high-speed data transfer in environments such as automotive telematics, industrial control systems, and advanced networking solutions.
Other people’s search terms
– High-speed communication chips
– Automotive-grade communication modules
– Industrial automation components
– Data transmission solutions
– Robust communication devices