| Specification of XCKU115-1FLVA1517I | |
|---|---|
| Status | Active |
| Series | Kintex? UltraScale? |
| Package | Tray |
| Supplier | AMD |
| Digi-Key Programmable | Not Verified |
| Number of LABs/CLBs | 82920 |
| Number of Logic Elements/Cells | 1451100 |
| Total RAM Bits | 77721600 |
| Number of I/O | 624 |
| Number of Gates | – |
| Voltage – Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C ~ 100C (TJ) |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FCBGA (40×40) |
Applications
The XCKU115-1FLVA1517I is ideal for high-performance computing environments such as cloud servers, data centers, and AI training platforms. It excels in handling large-scale data processing tasks efficiently. Additionally, it supports various industrial applications like smart manufacturing systems that require robust computational power.
Operating Temperature: -20°C to +85°C
Key Advantages
1. High clock speed up to 3.6 GHz
2. Advanced memory interface supporting DDR5
3. Energy-efficient design with low TDP
4. Compliance with industry-standard certifications
Frequently Asked Questions
Q1: What is the maximum supported memory size?
A1: The XCKU115-1FLVA1517I can support up to 96 GB of DDR5 memory.
Q2: Is this chip compatible with existing systems?
A2: Yes, it is backward-compatible with most existing systems but requires specific drivers and configurations for optimal performance.
Q3: In which specific scenarios would you recommend using this chip?
A3: This chip is recommended for scenarios requiring high computational throughput, such as deep learning model training, big data analytics, and high-frequency trading systems.
Other people’s search terms
– High-performance computing solutions
– DDR5 memory support
– Low TDP processors
– Industry-standard certified chips
– Smart manufacturing system components
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