| Specification of XCVU29P-3FSGA2577E | |
|---|---|
| Status | Active |
| Series | Virtex? UltraScale+? |
| Package | Tray |
| Supplier | AMD |
| Digi-Key Programmable | Not Verified |
| Number of LABs/CLBs | 216000 |
| Number of Logic Elements/Cells | 3780000 |
| Total RAM Bits | 99090432 |
| Number of I/O | 448 |
| Number of Gates | – |
| Voltage – Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C ~ 100C (TJ) |
| Package / Case | 2577-BBGA, FCBGA |
| Supplier Device Package | 2577-FCBGA (52.5×52.5) |
Applications
The XCVU29P-3FSGA2577E is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring fast processing speeds and large-scale parallel computing tasks. This device is also suitable for automotive electronics systems that demand reliable performance under varying conditions.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Advanced Architecture Design
3. Energy Efficiency Rating: 0.6W/MHz
4. Compliance with Industry Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: What is the maximum operating temperature of the XCVU29P-3FSGA2577E?
A1: The maximum operating temperature of the XCVU29P-3FSGA2577E is +85°C.
Q2: Can the XCVU29P-3FSGA2577E be used in automotive applications?
A2: Yes, it can be used in automotive applications due to its compliance with automotive industry standards and its ability to operate within a wide temperature range.
Q3: In which specific scenarios would you recommend using the XCVU29P-3FSGA2577E?
A3: The XCVU29P-3FSGA2577E is recommended for scenarios involving high-speed data processing, such as real-time signal processing in telecommunications networks and high-frequency trading in financial markets.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade FPGA
– Data center FPGA
– Cloud computing FPGA
– Fast processing FPGA
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