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XCVU125-2FLVB1760I

Part Number XCVU125-2FLVB1760I
Manufacturer Xilinx
Description IC FPGA 702 I/O 1760FCBGA
Price for XCVU125-2FLVB1760I
Specification of XCVU125-2FLVB1760I
Status Active
Series Virtex? UltraScale?
Package Bulk
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 89520
Number of Logic Elements/Cells 1566600
Total RAM Bits 90726400
Number of I/O 702
Number of Gates
Voltage – Supply 0.922V ~ 0.979V
Mounting Type Surface Mount
Operating Temperature -40C ~ 100C (TJ)
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5×42.5)

Applications

The XCVU125-2FLVB1760I is ideal for high-performance computing environments such as data centers, where it can handle large-scale data processing tasks efficiently. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS), where its robustness under various environmental conditions is crucial. Additionally, it finds application in telecommunications infrastructure, supporting complex network protocols and ensuring reliable communication services.

Key Advantages

1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced multi-core processing capabilities
3. Power Efficiency Data: Low power consumption per gigaflop compared to similar devices
4. Certification Standards: Meets stringent industrial and automotive safety certifications

Frequently Asked Questions

Q1: Can the XCVU125-2FLVB1760I operate effectively at extreme temperatures?

A1: Yes, it operates within a wide range from -40°C to +85°C, making it suitable for both cold and hot environments.

Q2: Is the XCVU125-2FLVB1760I compatible with existing hardware?

A2: The device is backward-compatible with most standard interfaces and can integrate seamlessly into existing systems without requiring significant redesigns.

Q3: In which specific scenarios would you recommend using the XCVU125-2FLVB1760I?

A3: This chip is recommended for scenarios involving high-speed data processing, such as real-time signal analysis in ADAS systems, and in critical telecommunications networks that require high reliability and performance.

Other people’s search terms

– High-performance computing solutions
– Automotive-grade processors
– Industrial-grade FPGA solutions
– Efficient data processing chips
– Robust telecommunication components

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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