Specification of XC2VP30-5FFG1152I | |
---|---|
Status | Obsolete |
Series | Virtex?-II Pro |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 3424 |
Number of Logic Elements/Cells | 30816 |
Total RAM Bits | 2506752 |
Number of I/O | 644 |
Number of Gates | – |
Voltage – Supply | 1.425V ~ 1.575V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 1152-BBGA, FCBGA |
Supplier Device Package | 1152-FCBGA (35×35) |
Applications
The XC2VP30-5FFG1152I is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in data centers where it handles large-scale data processing tasks efficiently. Additionally, it is suitable for automotive applications requiring robust and reliable performance under varying conditions.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced parallel processing
3. Power Efficiency: 1.5W per core at 1GHz
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XC2VP30-5FFG1152I operate effectively in extreme temperatures?
A1: Yes, it operates within a wide range of temperatures from -40°C to +85°C, making it suitable for various environmental conditions.
Q2: What are the power consumption details of the XC2VP30-5FFG1152I?
A2: The XC2VP30-5FFG1152I consumes approximately 1.5W per core when running at 1GHz, ensuring efficient power usage without compromising performance.
Q3: In which specific scenarios would you recommend using the XC2VP30-5FFG1152I?
A3: This chip is recommended for scenarios involving complex computational tasks such as machine learning algorithms, big data analytics, and high-frequency trading systems.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade processors
– Robust data center components
– Efficient power consumption technology
– Certified industrial-grade chips