XC6SLX150-3FGG676C

Applications

The XC6SLX150-3FGG676C is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and large-scale scientific simulations. This device supports operating temperatures ranging from -40°C to +85°C, making it suitable for various industrial settings.

Key Advantages

1. High clock speed up to 500 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR4 at speeds up to 2666 MT/s, enhancing data throughput.

3. Energy-efficient design with power consumption optimized for extended operation without overheating.

4. Compliance with multiple certification standards including CE, FCC, and RoHS, ensuring global market acceptance.

Frequently Asked Questions

Q1: Can the XC6SLX150-3FGG676C be used in extreme temperature conditions?

A1: Yes, it operates within a wide temperature range (-40°C to +85°C), making it suitable for both indoor and outdoor applications.

Q2: What are the specific memory configurations supported by the XC6SLX150-3FGG676C?

A2: The device supports dual-channel DDR4 memory with capacities up to 128 GB, offering flexibility in memory configuration options.

Q3: In which industries is the XC6SLX150-3FGG676C commonly deployed?

A3: Commonly deployed in telecommunications, automotive electronics, and aerospace sectors, where high reliability and performance are critical.

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