Specification of XC7Z007S-1CLG225I | |
---|---|
Status | Active |
Series | Zynq?-7000 |
Package | Tray |
Supplier | AMD |
Architecture | MCU, FPGA |
Core Processor | Single ARM Cortex-A9 MPCore with CoreSight |
Flash Size | – |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 667MHz |
Primary Attributes | Artix-7 FPGA, 23K Logic Cells |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 225-LFBGA, CSPBGA |
Supplier Device Package | 225-CSPBGA (13×13) |
Applications
The XC7Z007S-1CLG225I is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This device operates within a wide range of temperatures from -40°C to +85°C, ensuring reliability across various environmental conditions.
Key Advantages
1. High clock speed up to 667 MHz, providing superior computational performance.
2. Advanced memory interface supporting DDR4 at speeds up to 2133 MT/s, enhancing data throughput.
3. Energy-efficient design with power consumption optimized for extended operation without overheating.
4. Meets stringent industrial standards including CE, FCC, and RoHS certifications.
Frequently Asked Questions
Q1: Can the XC7Z007S-1CLG225I be used in high-temperature environments?
A1: Yes, it can operate effectively between -40°C and +85°C, making it suitable for both indoor and outdoor applications.
Q2: What is the maximum supported memory bandwidth?
A2: The XC7Z007S-1CLG225I supports DDR4 memory with a maximum bandwidth of 2133 MT/s, significantly improving data transfer rates.
Q3: In which specific scenarios would you recommend using this XC7Z007S-1CLG225I?
A3: This device is recommended for scenarios requiring high-speed data processing and analysis, such as real-time video streaming, machine learning model training, and large-scale database queries.
Other people’s search terms
– High-performance computing solutions
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– Cloud computing infrastructure components
– Industrial-grade memory interfaces
– Energy-efficient computing devices