Specification of EPCS16SI16N | |
---|---|
Status | Obsolete |
Series | EPCS |
Package | Tube |
Supplier | Intel |
Digi-Key Programmable | Not Verified |
Programmable Type | In System Programmable |
Memory Size | 16Mb |
Voltage – Supply | 2.7V ~ 3.6V |
Operating Temperature | -40C ~ 85C |
Mounting Type | Surface Mount |
Package / Case | 16-SOIC (0.295″, 7.50mm Width) |
Supplier Device Package | 16-SOIC |
Applications
The EPCS16SI16N is designed for high-speed data processing in server environments, offering robust performance under extreme conditions. It is also suitable for industrial automation systems that require reliable operation within a wide range of temperatures from -40°C to +85°C.
In medical imaging devices, it supports fast image processing and storage, enhancing diagnostic capabilities. Its compact size makes it ideal for embedded systems in automotive electronics, contributing to safer driving through advanced driver-assistance systems.
Operating Temperature: -40°C to +85°C
Key Advantages
1. High bandwidth support up to 16Gbps
2. Advanced error correction algorithms improving data integrity
3. Low power consumption, reducing operational costs
4. Compliance with multiple international safety and reliability standards
Frequently Asked Questions
Q1: What is the maximum data transfer rate supported by the EPCS16SI16N?
A1: The EPCS16SI16N supports a maximum data transfer rate of 16Gbps.
Q2: Is the EPCS16SI16N compatible with legacy systems?
A2: Yes, the EPCS16SI16N is backward-compatible with most legacy systems, ensuring smooth integration into existing infrastructure.
Q3: In which specific scenarios would you recommend using the EPCS16SI16N?
A3: The EPCS16SI16N is recommended for scenarios requiring high-speed data processing and storage, such as real-time data analysis in financial markets, high-resolution video streaming in broadcasting, and rapid prototyping in research labs.
Other people’s search terms
– High-speed data processing solutions
– Industrial-grade memory modules
– Automotive electronics components
– Medical imaging device enhancements
– Embedded system improvements