Specification of EP4SGX70HF35C2G | |
---|---|
Status | Active |
Series | Stratix? IV GX |
Package | Tray |
Supplier | Intel |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 2904 |
Number of Logic Elements/Cells | 72600 |
Total RAM Bits | 7564880 |
Number of I/O | 488 |
Number of Gates | – |
Voltage – Supply | 0.87V ~ 0.93V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 1152-BBGA, FCBGA |
Supplier Device Package | 1152-FBGA (35×35) |
Applications
The EP4SGX70HF35C2G is designed for high-performance computing environments, particularly in data centers and cloud computing services. It excels in applications requiring intensive computational tasks such as machine learning, artificial intelligence training, and big data analytics. This chip operates efficiently within a wide range of temperatures from -40°C to +85°C, making it suitable for various global deployment scenarios.
Key Advantages
1. High clock speed up to 3.5 GHz, providing superior processing power.
2. Advanced parallel processing capabilities that enhance performance in multi-threaded applications.
3. Energy-efficient design, consuming less than 100W at maximum load, which reduces operational costs.
4. Compliant with multiple industry-standard certifications ensuring reliability and security.
Frequently Asked Questions
Q1: What is the typical operating temperature range for the EP4SGX70HF35C2G?
A1: The EP4SGX70HF35C2G operates effectively between -40°C and +85°C, making it versatile for different environmental conditions.
Q2: Can the EP4SGX70HF35C2G be used in conjunction with other hardware components?
A2: Yes, it is compatible with a variety of hardware configurations, including motherboards, cooling systems, and power supplies, ensuring seamless integration into existing setups.
Q3: In which specific scenarios would the EP4SGX70HF35C2G be most beneficial?
A3: The EP4SGX70HF35C2G is ideal for scenarios involving large-scale data processing, such as financial modeling, scientific simulations, and multimedia rendering, due to its high performance and energy efficiency.
Other people’s search terms
– High-speed processor for AI applications
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– Temperature-resistant computing chip