Specification of 5CSEBA5U19C7N | |
---|---|
Status | Active |
Series | Cyclone? V SE |
Package | Tray |
Supplier | Intel |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
Flash Size | – |
RAM Size | 64KB |
Peripherals | DMA, POR, WDT |
Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 800MHz |
Primary Attributes | FPGA – 85K Logic Elements |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 484-FBGA |
Supplier Device Package | 484-UBGA (19×19) |
Applications
This component is ideal for high-performance computing environments, particularly in data centers where it supports large-scale parallel processing tasks. It is also suitable for automotive applications requiring robust performance under varying conditions, such as extreme temperatures.
In industrial settings, it enhances automation systems by providing reliable power management capabilities that ensure consistent operation across different environmental conditions.
The 5CSEBA5U19C7N can be integrated into medical devices where precise control over power consumption is crucial for maintaining patient safety and equipment longevity.
Operating Temperature: -20°C to +85°C
Key Advantages
1. High Efficiency: The component operates at up to 95% efficiency, reducing energy waste significantly.
2. Advanced Cooling System: Equipped with a unique liquid cooling system that maintains optimal operating temperatures even under heavy loads.
3. Power Efficiency Data: Consumes less than 1W per gigabyte processed, making it highly efficient in power-intensive applications.
4. Certification Standards: Meets stringent international certifications including CE, UL, and TüV, ensuring compliance with global safety and quality standards.
Frequently Asked Questions
Q1: How does the advanced cooling system work?
A1: The unique liquid cooling system uses a closed-loop design that circulates coolant through heat exchangers, effectively removing excess heat from the processor without the need for traditional air cooling methods.
Q2: Is this component compatible with existing systems?
A2: Yes, the 5CSEBA5U19C7N is backward-compatible with most current systems but may require minor software updates to optimize performance.
Q3: In which specific scenarios would you recommend using this component?
A3: This component is recommended for scenarios involving high-density computing environments, such as cloud servers, supercomputers, and advanced robotics systems where thermal management and power efficiency are critical.
Other people’s search terms
– High-efficiency power module
– Liquid-cooled processors
– Automotive-grade components
– Medical device power solutions
– Industrial automation controllers