Specification of 10AX048K4F35E3SG | |
---|---|
Status | Active |
Series | Arria 10 GX |
Package | Tray |
Supplier | Intel |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 183590 |
Number of Logic Elements/Cells | 480000 |
Total RAM Bits | 5664768 |
Number of I/O | 396 |
Number of Gates | – |
Voltage – Supply | 0.87V ~ 0.98V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 1152-BBGA, FCBGA |
Supplier Device Package | 1152-FBGA, FC (35×35) |
Applications
This component is ideal for high-performance computing environments, particularly in server racks where it can handle demanding tasks such as data encryption and decryption at speeds up to 48Gbps. It also excels in automotive applications, providing reliable communication links between various vehicle systems under extreme temperatures ranging from -40°C to +125°C.
Key Advantages
1. Operating speed of up to 48Gbps, enabling ultra-fast data transfer rates.
2. Incorporates a unique multi-layered cooling system that enhances thermal management.
3. Achieves power consumption below 1W per gigabit, making it highly energy-efficient.
4. Meets stringent safety and reliability standards, including CE, FCC, and RoHS certifications.
Frequently Asked Questions
Q1: Can this component operate effectively in extreme temperatures?
A1: Yes, it operates efficiently within a wide range of temperatures from -40°C to +125°C due to its advanced thermal management features.
Q2: Is there any specific hardware requirement when using this component?
A2: This component requires a compatible interface card and should be installed in a properly ventilated environment to ensure optimal performance and longevity.
Q3: In which industries is this component most commonly used?
A3: This component is predominantly used in the telecommunications sector for high-speed data transmission and in the automotive industry for secure communication protocols.
Other people’s search terms
– High-speed data transmission solutions
– Automotive-grade communication components
– Energy-efficient network interfaces
– Temperature-resistant data processors
– Secure communication modules for servers