Specification of EP3SL110F780C3N | |
---|---|
Status | Obsolete |
Series | Stratix? III L |
Package | Tray |
Supplier | Intel |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 4300 |
Number of Logic Elements/Cells | 107500 |
Total RAM Bits | 4992000 |
Number of I/O | 488 |
Number of Gates | – |
Voltage – Supply | 0.86V ~ 1.15V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 780-BBGA, FCBGA |
Supplier Device Package | 780-FBGA (29×29) |
Applications
The EP3SL110F780C3N is ideal for high-performance computing environments, particularly in data centers where it supports large-scale parallel processing tasks. It excels in scientific research applications such as climate modeling and molecular dynamics simulations, offering exceptional computational power. Additionally, its robust design makes it suitable for industrial automation systems requiring precise control and monitoring.
Key Advantages
1. High clock speed up to 3.8 GHz, enabling faster execution of complex algorithms.
2. Advanced memory management system that optimizes data access patterns for improved performance.
3. Energy-efficient design with low power consumption per core, reducing operational costs.
4. Compliant with multiple industry-standard certifications ensuring reliability and security.
Frequently Asked Questions
Q1: What is the maximum operating temperature supported by the EP3SL110F780C3N?
A1: The EP3SL110F780C3N operates within a wide temperature range from -40°C to +85°C, making it suitable for various environmental conditions.
Q2: Can the EP3SL110F780C3N be integrated into existing systems without modifications?
A2: Yes, the EP3SL110F780C3N is backward compatible with previous models, allowing seamless integration into existing infrastructure with minimal changes.
Q3: In which specific scenarios would you recommend using the EP3SL110F780C3N?
A3: The EP3SL110F780C3N is recommended for scenarios involving real-time data analysis, high-frequency trading, and advanced machine learning models where high-speed processing and energy efficiency are critical.
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