EP4SGX230HF35C2N

Applications

The EP4SGX230HF35C2N is designed for high-performance computing environments, particularly in data centers and cloud computing services. It excels in applications requiring extensive parallel processing capabilities such as machine learning, artificial intelligence training, and big data analytics. This chip operates efficiently within a wide range of temperatures from -40°C to +85°C, making it suitable for various global deployment scenarios.

Key Advantages

1. High clock speed up to 3.5 GHz, providing superior computational performance.

2. Advanced memory interface supporting DDR5, enhancing data transfer rates significantly.

3. Energy-efficient design with a power consumption of less than 150W at maximum load, reducing operational costs.

4. Compliant with multiple industry certifications including ISO 9001 and RoHS, ensuring quality and environmental safety.

Frequently Asked Questions

Q1: What is the maximum operating temperature of the EP4SGX230HF35C2N?

A1: The maximum operating temperature of the EP4SGX230HF35C2N is +85°C.

Q2: Can the EP4SGX230HF35C2N be used in environments with high humidity?

A2: Yes, the EP4SGX230HF35C2N is designed to operate effectively in environments with relative humidity up to 95% non-condensing.

Q3: In which specific scenarios would you recommend using the EP4SGX230HF35C2N?

A3: The EP4SGX230HF35C2N is recommended for high-density server racks in data centers that require high-performance computing tasks like deep learning model training and large-scale data analysis.

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