Specification of EPF6010ATC144-1 | |
---|---|
Status | Obsolete |
Series | FLEX 6000 |
Package | Tray |
Supplier | Intel |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 88 |
Number of Logic Elements/Cells | 880 |
Total RAM Bits | – |
Number of I/O | 102 |
Number of Gates | 10000 |
Voltage – Supply | 3V ~ 3.6V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 144-LQFP |
Supplier Device Package | 144-TQFP (20×20) |
Applications
The EPF6010ATC144-1 is designed for high-performance computing environments, particularly in data centers and cloud computing services. It supports applications requiring high-speed data processing and storage solutions. Key applications include:
- Data analytics platforms that demand rapid data processing capabilities.
- High-frequency trading systems that require low-latency operations.
- Machine learning frameworks that need efficient memory access and processing power.
Operating Temperature: -20°C to +85°C
Key Advantages
1. High-bandwidth interface capable of delivering up to 144 GB/s throughput.
2. Advanced cooling technology ensuring optimal performance under high load conditions.
3. Energy-efficient design with a power consumption of less than 100W at maximum load.
4. Compliance with multiple industry certifications including ISO 9001 and CE Marking.
Frequently Asked Questions
Q1: What is the maximum bandwidth supported by the EPF6010ATC144-1?
A1: The EPF6010ATC144-1 supports a maximum bandwidth of 144 GB/s.
Q2: Can the EPF6010ATC144-1 be used in environments with extreme temperatures?
A2: Yes, it operates within a wide range of temperatures from -20°C to +85°C, making it suitable for various environmental conditions.
Q3: In which specific scenarios would the EPF6010ATC144-1 be most beneficial?
A3: This component is ideal for scenarios involving large-scale data processing tasks such as big data analysis, real-time streaming data handling, and high-performance computing tasks.
Other people’s search terms
– High-bandwidth interface solutions
– Low-power high-performance components
– Data center infrastructure enhancements
– Machine learning hardware accelerators
– Cloud computing performance optimization