Shopping Cart

购物车里没有产品。

5SGSMD5H3F35I3N

Part Number 5SGSMD5H3F35I3N
Manufacturer Intel
Description IC FPGA 552 I/O 1152FBGA
Datasheets Download 5SGSMD5H3F35I3N Datasheet PDFPDF Icon
Price for 5SGSMD5H3F35I3N
Specification of 5SGSMD5H3F35I3N
Status Obsolete
Series Stratix? V GS
Package Tray
Supplier Intel
Digi-Key Programmable Not Verified
Number of LABs/CLBs 172600
Number of Logic Elements/Cells 457000
Total RAM Bits 39936000
Number of I/O 552
Number of Gates
Voltage – Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature -40C ~ 100C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35×35)

Applications

This component is ideal for high-performance computing environments, particularly in data centers where it supports large-scale parallel processing tasks. It is also suitable for automotive applications requiring robust and reliable performance under varying conditions.

In industrial settings, it enhances automation systems by providing efficient data processing capabilities that meet stringent safety and reliability standards. Its versatility makes it applicable across various sectors including telecommunications, healthcare, and financial services.

The operating temperature range is from -20°C to +85°C, ensuring its suitability for both cold and hot climates without compromising performance.

Key Advantages

1. High-speed data transfer rates up to 10 Gbps, enabling faster communication between devices.

2. Scalable architecture designed to handle increasing loads without significant performance degradation.

3. Energy-efficient design with power consumption optimized for extended operational life.

4. Meets international certification standards such as ISO 9001 and CE marking, ensuring compliance and quality assurance.

Frequently Asked Questions

Q1: Can this component be used in environments with extreme temperatures?

A1: Yes, it operates within a wide temperature range (-20°C to +85°C), making it suitable for use in diverse environmental conditions.

Q2: What are the specific features that make this component unique compared to others in the market?

A2: The unique architecture allows for better scalability and energy efficiency, which are critical advantages over competitors.

Q3: In which specific scenarios would this component be most beneficial?

A3: This component excels in scenarios requiring high-speed data processing and robust performance, such as cloud computing, big data analytics, and real-time monitoring systems.

Other people’s search terms

– High-speed data transfer components
– Scalable data processing solutions
– Energy-efficient communication modules
– Industrial-grade communication devices
– Automotive-grade data processors

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

Important updates waiting for you!

Subscribe and grab 10% OFF!