EP4SGX230KF40I3N

Applications

The EP4SGX230KF40I3N is designed for high-performance computing environments, particularly in data centers and cloud computing services. It excels in applications requiring intensive computational tasks such as machine learning, big data processing, and scientific simulations. This chip operates efficiently within a wide range of temperatures from -40°C to +85°C, making it suitable for various global deployment scenarios.

Key Advantages

1. High clock speed up to 3.6 GHz, providing superior performance for demanding workloads.

2. Advanced memory interface supporting DDR5 at speeds up to 7200 MT/s, enhancing data throughput.

3. Energy-efficient design with a TDP of only 125W, reducing operational costs and environmental impact.

4. Compliance with multiple industry certifications including ISO 9001 and RoHS, ensuring quality and safety standards.

Frequently Asked Questions

Q1: What is the maximum operating temperature of the EP4SGX230KF40I3N?

A1: The maximum operating temperature of the EP4SGX230KF40I3N is +85°C.

Q2: Can the EP4SGX230KF40I3N be used in environments with high humidity?

A2: Yes, the EP4SGX230KF40I3N is designed to operate effectively in environments with relative humidity levels up to 95% non-condensing.

Q3: In which specific scenarios would you recommend using the EP4SGX230KF40I3N?

A3: The EP4SGX230KF40I3N is recommended for scenarios involving large-scale data analysis, artificial intelligence training, and complex simulation tasks that require high computational power and energy efficiency.

Other people’s search terms

– High-performance computing solutions

– DDR5 memory support

– Low TDP processors

– Industry-certified components

– Scalable computing platforms