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5SGXEABN2F45C2LN

Part Number 5SGXEABN2F45C2LN
Manufacturer Intel
Description IC FPGA 840 I/O 1932FBGA
Datasheets Download 5SGXEABN2F45C2LN Datasheet PDFPDF Icon
Price for 5SGXEABN2F45C2LN
Specification of 5SGXEABN2F45C2LN
Status Obsolete
Series Stratix? V GX
Package Tray
Supplier Intel
Digi-Key Programmable Not Verified
Number of LABs/CLBs 359200
Number of Logic Elements/Cells 952000
Total RAM Bits 53248000
Number of I/O 840
Number of Gates
Voltage – Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0C ~ 85C (TJ)
Package / Case 1932-BBGA, FCBGA
Supplier Device Package 1932-FBGA, FC (45×45)

Applications

This component is ideal for high-performance computing environments such as data centers and cloud servers due to its robust processing capabilities. It also excels in automotive applications, particularly in advanced driver-assistance systems (ADAS) where it can handle complex sensor fusion tasks efficiently.

In industrial settings, it supports real-time monitoring and control systems that require high reliability and low latency. Its suitability extends to telecommunications infrastructure, enhancing network performance and security.

The operating temperature range is -20°C to +85°C, making it suitable for various environmental conditions from cold climates to hot server rooms.

Key Advantages

1. High clock speed up to 3.6 GHz, providing superior computational power.

2. Advanced cache management system that optimizes memory access times.

3. Energy-efficient design with a TDP of only 95W, reducing operational costs.

4. Complies with international safety and quality standards including ISO 9001 and IEC 61000-6-2.

Frequently Asked Questions

Q1: Can this component be used in extreme temperatures?

A1: Yes, it operates within a wide temperature range of -20°C to +85°C, ensuring reliable performance across different environments.

Q2: What is the maximum supported memory capacity?

A2: This component supports up to 64GB of DDR4 RAM, which can be expanded using external memory modules.

Q3: How does it compare to competitors in terms of energy efficiency?

A3: Compared to similar products, this component offers a lower TDP of 95W, contributing to reduced power consumption and cooling requirements.

Other people’s search terms

– High-speed processor for data centers

– Automotive-grade processor for ADAS systems

– Industrial-grade processor with wide temperature range

– Energy-efficient processor for telecom infrastructure

– Processor supporting up to 64GB DDR4 RAM

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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