Specification of XCZU7EV-3FBVB900E | |
---|---|
Status | Active |
Series | Zynq? UltraScale+? MPSoC EV |
Package | Tray |
Supplier | AMD |
Architecture | MCU, FPGA |
Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight |
Flash Size | – |
RAM Size | 256KB |
Peripherals | DMA, WDT |
Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 600MHz, 1.5GHz |
Primary Attributes | ZynqUltraScale+ FPGA, 504K+ Logic Cells |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 900-BBGA, FCBGA |
Supplier Device Package | 900-FCBGA (31×31) |
Applications
The XCZU7EV-3FBVB900E is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It excels in applications requiring high-speed data processing and large-scale parallel computing tasks. This FPGA can operate within a wide range of temperatures from -40¡ãC to +85¡ãC, making it suitable for various industrial settings.
Key Advantages
1. High computational throughput up to 6.5 Gbps per lane at 1.2V supply voltage.
2. Advanced multi-core architecture supporting up to 16 independent processing cores.
3. Energy consumption as low as 1.5W at 1.2V supply voltage under typical usage conditions.
4. Meets stringent industry certifications including CE, FCC, and RoHS compliance.
Frequently Asked Questions
Q1: Can the XCZU7EV-3FBVB900E be used in high-temperature environments?
A1: Yes, the XCZU7EV-3FBVB900E operates effectively within a temperature range of -40¡ãC to +85¡ãC, ensuring reliability in diverse environmental conditions.
Q2: What is the power efficiency of the XCZU7EV-3FBVB900E?
A2: The XCZU7EV-3FBVB900E achieves energy efficiency as low as 1.5W at 1.2V supply voltage, making it highly efficient for power-sensitive applications.
Q3: In which specific scenarios would you recommend using the XCZU7EV-3FBVB900E?
A3: The XCZU7EV-3FBVB900E is recommended for scenarios involving complex signal processing, such as in telecommunications networks, automotive electronics, and advanced medical imaging systems.
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