Specification of XCVU9P-2FLGB2104E | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 147780 |
Number of Logic Elements/Cells | 2586150 |
Total RAM Bits | 391168000 |
Number of I/O | 702 |
Number of Gates | – |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 2104-BBGA, FCBGA |
Supplier Device Package | 2104-FCBGA (47.5×47.5) |
Applications
The XCVU9P-2FLGB2104E is ideal for high-performance computing environments such as data centers, where it can handle large-scale data processing tasks efficiently. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS), where its robustness under extreme conditions is crucial. Additionally, it finds application in telecommunications infrastructure, supporting complex network protocols and ensuring reliable communication services.
Key Advantages
1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Unique Architecture Feature: Advanced parallel processing capabilities
3. Power Efficiency: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XCVU9P-2FLGB2104E operate effectively at high temperatures?
A1: Yes, it operates within a wide range (-40¡ãC to +85¡ãC) making it suitable for various environmental conditions.
Q2: Is the XCVU9P-2FLGB2104E compatible with existing hardware?
A2: The XCVU9P-2FLGB2104E is backward-compatible with previous models but may require specific drivers and firmware updates for optimal performance.
Q3: In which specific scenarios would you recommend using the XCVU9P-2FLGB2104E?
A3: This chip is recommended for scenarios requiring high computational power and reliability, such as real-time data analysis in financial markets, autonomous vehicle navigation systems, and critical telecommunication networks.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Telecommunications hardware
– Data center processors
– Robust processor for extreme conditions