Specification of XCVU9P-2FLGA2104E | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 147780 |
Number of Logic Elements/Cells | 2586150 |
Total RAM Bits | 391168000 |
Number of I/O | 832 |
Number of Gates | – |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 2104-BBGA, FCBGA |
Supplier Device Package | 2104-FCBGA (47.5×47.5) |
Applications
The XCVU9P-2FLGA2104E is ideal for high-performance computing environments such as data centers, cloud computing services, and artificial intelligence training. It excels in handling large-scale data processing tasks efficiently. In industrial settings, it supports advanced automation systems that require rapid decision-making processes. Additionally, its robust design makes it suitable for automotive applications where reliability under extreme conditions is crucial.
Key Advantages
1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Unique Architecture Feature: Advanced parallel processing capabilities
3. Power Efficiency: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: What is the maximum operating temperature of the XCVU9P-2FLGA2104E?
A1: The maximum operating temperature of the XCVU9P-2FLGA2104E is +85¡ãC.
Q2: Can the XCVU9P-2FLGA2104E be used in automotive applications?
A2: Yes, the XCVU9P-2FLGA2104E is designed to meet automotive grade standards, ensuring reliable performance in harsh environments.
Q3: How does the unique architecture feature of the XCVU9P-2FLGA2104E enhance its performance compared to other processors?
A3: The unique architecture feature allows for more efficient parallel processing, significantly enhancing computational speed and throughput.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade processor
– Cloud computing acceleration
– AI training optimization
– Industrial automation systems