| Specification of XCVU9P-1FSGD2104I | |
|---|---|
| Status | Active |
| Series | Virtex? UltraScale+? |
| Package | Tray |
| Voltage – Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40¡ãC ~ 100¡ãC (TJ) |
| Package / Case | 2104-BBGA, FCBGA |
| Supplier Device Package | 2104-FCBGA (47.5×47.5) |
| Number of LABs/CLBs | 147780 |
| Number of Logic Elements/Cells | 2586150 |
| Total RAM Bits | 391168000 |
| Number of I/O | 676 |
Applications
The XCVU9P-1FSGD2104I is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring fast processing speeds and large-scale parallel computing tasks. This device is also suitable for automotive electronics systems due to its robust design and reliability under various environmental conditions.
Key Advantages
1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Unique Architecture Feature: Advanced multi-core processing capabilities
3. Power Efficiency Data: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: What is the maximum clock frequency supported by the XCVU9P-1FSGD2104I?
A1: The XCVU9P-1FSGD2104I supports a maximum clock frequency of up to 600 MHz.
Q2: Is the XCVU9P-1FSGD2104I compatible with existing hardware?
A2: Yes, it is backward compatible with most existing hardware interfaces and can be integrated into new designs without significant modifications.
Q3: In which specific scenarios would you recommend using the XCVU9P-1FSGD2104I?
A3: The XCVU9P-1FSGD2104I is recommended for scenarios that require high computational power and energy efficiency, such as machine learning algorithms, big data analytics, and real-time signal processing.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Cloud computing hardware
– Energy-efficient processors
– Multi-core processing technology
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