Specification of XCVU7P-1FLVC2104I | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | -40¡ãC ~ 100¡ãC (TJ) |
Package / Case | 2104-BBGA, FCBGA |
Supplier Device Package | 2104-FCBGA (47.5×47.5) |
Number of LABs/CLBs | 98520 |
Number of Logic Elements/Cells | 1724100 |
Total RAM Bits | 260812800 |
Number of I/O | 416 |
Applications
The XCVU7P-1FLVC2104I is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring fast processing speeds and large-scale parallel computing tasks. Additionally, it is suitable for automotive electronics systems due to its robustness and reliability under various environmental conditions.
Key Advantages
1. High clock speed up to 600 MHz
2. Advanced multi-core architecture supporting up to 8 cores
3. Energy-efficient design with power consumption as low as 15W at maximum load
4. Meets industry-standard certifications including ISO 9001 and CE Marking
Frequently Asked Questions
Q1: What is the maximum operating temperature range supported by the XCVU7P-1FLVC2104I?
A1: The XCVU7P-1FLVC2104I operates within a temperature range from -40¡ãC to +85¡ãC, ensuring reliable performance across a wide range of environments.
Q2: Can the XCVU7P-1FLVC2104I be used in conjunction with other components to form a complete system solution?
A2: Yes, the XCVU7P-1FLVC2104I can be integrated with various peripheral devices and software modules to create comprehensive system solutions tailored to specific application needs.
Q3: In which specific scenarios would the XCVU7P-1FLVC2104I be most beneficial?
A3: The XCVU7P-1FLVC2104I is particularly beneficial in scenarios requiring high-speed data processing, such as real-time signal analysis in telecommunications networks, and in automotive applications where rapid response times are critical.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Data center hardware specifications
– Multi-core processor technology
– Energy-efficient computing devices