Specification of XCVU5P-3FLVC2104E | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 75072 |
Number of Logic Elements/Cells | 1313763 |
Total RAM Bits | 190976000 |
Number of I/O | 416 |
Number of Gates | – |
Voltage – Supply | 0.873V ~ 0.927V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 2104-BBGA, FCBGA |
Supplier Device Package | 2104-FCBGA (47.5×47.5) |
Applications
The XCVU5P-3FLVC2104E is ideal for high-performance computing environments such as data centers, where it can handle large-scale data processing tasks efficiently. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS), where its robustness under various environmental conditions is crucial. Additionally, it finds application in telecommunications infrastructure, supporting complex network protocols and ensuring reliable communication services.
Key Advantages
1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Unique Architecture Feature: Advanced multi-core processing capabilities
3. Power Efficiency Data: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XCVU5P-3FLVC2104E operate effectively in extreme temperatures?
A1: Yes, it operates within a wide range of temperatures from -40¡ãC to +85¡ãC, making it suitable for both indoor and outdoor applications.
Q2: Is the XCVU5P-3FLVC2104E compatible with existing hardware?
A2: The XCVU5P-3FLVC2104E is backward-compatible with previous models but offers enhanced performance and features that may require updates to the software stack.
Q3: In which specific scenarios would you recommend using the XCVU5P-3FLVC2104E?
A3: This chip is recommended for scenarios requiring high computational power and reliability, such as real-time signal processing in ADAS systems, high-frequency trading in financial markets, and critical communications in remote sensing applications.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Telecommunications network processors
– Robust temperature operation devices
– Enhanced multi-core processing chips