Specification of XCVU5P-1FLVB2104E | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 75072 |
Number of Logic Elements/Cells | 1313763 |
Total RAM Bits | 190976000 |
Number of I/O | 702 |
Number of Gates | – |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 2104-BBGA, FCBGA |
Supplier Device Package | 2104-FCBGA (47.5×47.5) |
Applications
The XCVU5P-1FLVB2104E is ideal for high-performance computing environments such as data centers, where it can handle large-scale data processing tasks efficiently. It is also suitable for automotive applications requiring robust and reliable performance under varying conditions. Additionally, its capabilities make it a strong candidate for telecommunications infrastructure, supporting complex network protocols.
Key Advantages
1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Unique Architecture Feature: Advanced parallel processing capabilities
3. Power Efficiency: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XCVU5P-1FLVB2104E be used in extreme temperatures?
A1: Yes, it operates within a wide range from -40¡ãC to +85¡ãC, making it suitable for various environmental conditions.
Q2: Is there any specific hardware requirement when using this chip?
A2: The chip requires a stable power supply and adequate cooling solutions due to its high computational load.
Q3: In which specific scenarios would you recommend using the XCVU5P-1FLVB2104E?
A3: This chip is recommended for scenarios involving real-time data analysis, high-speed networking, and advanced AI applications that demand high performance and reliability.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Telecommunications network processors
– Robust data center hardware
– Advanced AI processing chips