Specification of XCVU29P-3FSGA2577E | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 216000 |
Number of Logic Elements/Cells | 3780000 |
Total RAM Bits | 99090432 |
Number of I/O | 448 |
Number of Gates | – |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 2577-BBGA, FCBGA |
Supplier Device Package | 2577-FCBGA (52.5×52.5) |
Applications
The XCVU29P-3FSGA2577E is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring fast processing speeds and large-scale parallel computing tasks. This device is also suitable for automotive electronics systems that demand robust performance under varying conditions.
Key Advantages
1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Advanced Architecture: Supports up to 64-bit wide data paths
3. Power Efficiency: Achieves up to 20% lower power consumption compared to similar devices
4. Certification Standards: Meets international safety and reliability standards
Frequently Asked Questions
Q1: What is the maximum clock frequency supported by the XCVU29P-3FSGA2577E?
A1: The XCVU29P-3FSGA2577E supports a maximum clock frequency of 1.5 GHz.
Q2: Is the XCVU29P-3FSGA2577E compatible with existing hardware?
A2: Yes, it is backward compatible with previous generations but offers enhanced features and performance improvements.
Q3: In which specific scenarios would you recommend using the XCVU29P-3FSGA2577E?
A3: The XCVU29P-3FSGA2577E is recommended for scenarios involving real-time data processing, high-speed networking, and complex algorithmic computations.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Data center hardware upgrades
– Cloud computing acceleration
– Robust parallel computing devices