| Specification of XCVU27P-2FIGD2104E | |
|---|---|
| Status | Active |
| Series | Virtex? UltraScale+? |
| Voltage – Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0¡ãC ~ 100¡ãC (TJ) |
| Package / Case | 2104-BBGA, FCBGA |
| Supplier Device Package | 2104-FCBGA (52.5×52.5) |
| Number of LABs/CLBs | 162000 |
| Number of Logic Elements/Cells | 2835000 |
| Total RAM Bits | 74344038 |
| Number of I/O | 676 |
Applications
The XCVU27P-2FIGD2104E is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring fast processing speeds and large-scale parallel computing tasks. Additionally, it is suitable for automotive electronics systems that demand robust performance under varying conditions.
Key Advantages
1. High clock speed up to 600 MHz
2. Advanced multi-core architecture
3. Energy-efficient design with low power consumption
4. Compliance with multiple industry safety and reliability standards
Frequently Asked Questions
Q1: What is the maximum operating temperature range?
A1: The XCVU27P-2FIGD2104E operates within a temperature range from -40¡ãC to +85¡ãC.
Q2: Can this device be used in automotive applications?
A2: Yes, it meets the stringent automotive grade requirements for reliability and safety.
Q3: In which specific scenarios would you recommend using this device?
A3: This device is recommended for high-speed data processing in financial trading systems, where rapid decision-making is critical.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade FPGA devices
– Fast processing FPGAs
– Reliable FPGA for industrial applications
– Efficient FPGA for data centers
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