XCVU23P-L2FSVJ1760E

Applications

The XCVU23P-L2FSVJ1760E is ideal for high-performance computing environments such as data centers, cloud computing services, and artificial intelligence training. It excels in handling large-scale data processing tasks efficiently. In industrial settings, it supports advanced automation systems that require rapid decision-making processes. Additionally, its robust design makes it suitable for automotive applications where reliability under extreme conditions is crucial.

Key Advantages

1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Unique Architecture Feature: Advanced parallel processing capabilities
3. Power Efficiency: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS

Frequently Asked Questions

Q1: What is the maximum operating temperature of the XCVU23P-L2FSVJ1760E?

A1: The maximum operating temperature of the XCVU23P-L2FSVJ1760E is +85¡ãC.

Q2: Can the XCVU23P-L2FSVJ1760E be used in environments with high humidity?

A2: Yes, the XCVU23P-L2FSVJ1760E has been certified for use in environments with up to 95% relative humidity at temperatures up to +85¡ãC.

Q3: How does the XCVU23P-L2FSVJ1760E perform in high-altitude applications?

A3: The XCVU23P-L2FSVJ1760E maintains optimal performance even at altitudes up to 3000 meters above sea level due to its robust thermal management system.

Other people’s search terms

– High-performance computing solutions
– Automotive electronics components
– Industrial automation processors
– Cloud computing hardware
– Artificial intelligence accelerators