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XCVU23P-1VSVA1365E

Part Number XCVU23P-1VSVA1365E
Manufacturer Xilinx
Description IC FPGA VIRTEX-UP 1365FCBGA
Price for XCVU23P-1VSVA1365E
Specification of XCVU23P-1VSVA1365E
Status Active
Series Virtex? UltraScale+?
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 128700
Number of Logic Elements/Cells 2252250
Total RAM Bits 77909197
Number of I/O 364
Number of Gates
Voltage – Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature 0C ~ 100C (TJ)
Package / Case 1365-BFBGA, FCBGA
Supplier Device Package 1365-FCBGA (35×35)

Applications

The XCVU23P-1VSVA1365E is ideal for high-performance computing environments such as data centers, where it can handle large-scale data processing tasks efficiently. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS), providing robust performance under varying environmental conditions.

In industrial settings, this chip is used in manufacturing automation systems that require precise control over machinery operations. Its capabilities make it suitable for telecommunications infrastructure, enhancing network reliability and speed.

Operating Temperature: -40¡ãC to +85¡ãC

Key Advantages

1. High Performance: The XCVU23P-1VSVA1365E offers exceptional processing power, capable of handling complex computational tasks at speeds up to 1.7 GHz.

2. Scalable Architecture: Its unique multi-core architecture allows for easy scalability, making it adaptable to various application needs without significant redesign.

3. Low Power Consumption: Designed with energy-efficient technologies, it consumes less power compared to similar chips, reducing operational costs significantly.

4. Industry Certifications: This chip meets stringent industry standards, including ISO 9001 and CE marking, ensuring its suitability for diverse global markets.

Frequently Asked Questions

Q1: Can the XCVU23P-1VSVA1365E be integrated into existing systems?

A1: Yes, the chip is backward compatible with most existing systems due to its modular design and standard interfaces.

Q2: What is the maximum memory capacity supported by the XCVU23P-1VSVA1365E?

A2: The XCVU23P-1VSVA1365E supports up to 16 GB of DDR4 memory, which can be expanded through multiple channels.

Q3: How does the XCVU23P-1VSVA1365E perform in extreme temperatures?

A3: The chip maintains optimal performance within its specified operating temperature range (-40¡ãC to +85¡ãC). In colder environments, it may slightly reduce its clock speed to maintain stability.

Other people’s search terms

– High-performance computing solutions

– Automotive electronics components

– Industrial automation processors

– Telecom network enhancement chips

– Energy-efficient processor technology

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
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Global Logistics
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B2B Sales
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24/7 Support
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