Specification of XCVU19P-2FSVB3824E | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 510720 |
Number of Logic Elements/Cells | 8937600 |
Total RAM Bits | 79586918 |
Number of I/O | 1760 |
Number of Gates | – |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 3824-BBGA, FCBGA |
Supplier Device Package | 3824-FCBGA (65×65) |
Applications
The XCVU19P-2FSVB3824E is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring high-speed processing and large-scale parallel computing tasks. This device is also suitable for automotive electronics systems that demand robust performance under varying environmental conditions.
Key Advantages
1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Advanced Architecture: Supports up to 64-bit wide data paths
3. Power Efficiency: Achieves up to 70% power reduction compared to previous models
4. Certification Standards: Meets ISO 9001 and CE marking requirements
Frequently Asked Questions
Q1: What is the maximum clock frequency supported by the XCVU19P-2FSVB3824E?
A1: The XCVU19P-2FSVB3824E supports a maximum clock frequency of 1.5 GHz.
Q2: Is the XCVU19P-2FSVB3824E compatible with existing hardware?
A2: Yes, it is backward compatible with most existing hardware interfaces but requires specific drivers for optimal performance.
Q3: In which specific scenarios would you recommend using the XCVU19P-2FSVB3824E?
A3: The XCVU19P-2FSVB3824E is recommended for scenarios involving real-time signal processing, high-bandwidth data transfer, and complex algorithmic computations.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Data center infrastructure
– Cloud computing acceleration
– Robust parallel computing devices