Specification of XCVU13P-L2FSGA2577E | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 216000 |
Number of Logic Elements/Cells | 3780000 |
Total RAM Bits | 99090432 |
Number of I/O | 448 |
Number of Gates | – |
Voltage – Supply | 0.698V ~ 0.742V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 2577-BBGA, FCBGA |
Supplier Device Package | 2577-FCBGA (52.5×52.5) |
Applications
The XCVU13P-L2FSGA2577E is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring high-speed processing and large-scale parallel computing tasks. In the automotive industry, it supports advanced driver assistance systems (ADAS) and autonomous driving features due to its robust performance under varying conditions.
Key Advantages
1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Unique Architecture Feature: Advanced multi-core processing capabilities
3. Power Efficiency: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: What is the maximum clock frequency supported by the XCVU13P-L2FSGA2577E?
A1: The XCVU13P-L2FSGA2577E supports a maximum clock frequency of up to 600 MHz.
Q2: Is the XCVU13P-L2FSGA2577E compatible with existing hardware?
A2: Yes, the XCVU13P-L2FSGA2577E is backward compatible with previous generations of Xilinx FPGAs, ensuring seamless integration into existing designs.
Q3: Can the XCVU13P-L2FSGA2577E be used in extreme environmental conditions?
A3: Yes, the XCVU13P-L2FSGA2577E operates within a wide range of temperatures (-40¡ãC to +85¡ãC), making it suitable for use in harsh environments like industrial settings and outdoor deployments.
Other people’s search terms
– High-performance FPGA solutions
– Automotive-grade FPGA processors
– Data center FPGA technology
– Cloud computing FPGA applications
– Robust FPGA architectures