Shopping Cart

购物车里没有产品。

XCV200E-6FG256C

Part Number XCV200E-6FG256C
Manufacturer Xilinx
Description IC FPGA 176 I/O 256FBGA
Datasheets Download XCV200E-6FG256C Datasheet PDFPDF Icon
Price for XCV200E-6FG256C
Specification of XCV200E-6FG256C
Status Obsolete
Series Virtex?-E
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 1176
Number of Logic Elements/Cells 5292
Total RAM Bits 114688
Number of I/O 176
Number of Gates 306393
Voltage – Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0C ~ 85C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FBGA (17×17)

Applications

The XCV200E-6FG256C is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and storage solutions, including video encoding/decoding, big data analytics, and machine learning algorithms.

In industrial settings, it can be utilized in automation control systems that demand precise timing and reliability, such as manufacturing robots and smart grid technologies. Its robust design ensures it operates effectively within a wide range of temperatures from -40¡ãC to +85¡ãC.

Key Advantages

1. The XCV200E-6FG256C features a 64-bit processor core capable of handling complex computational tasks efficiently.

2. Its unique architecture includes integrated cache memory, enhancing performance without increasing power consumption.

3. The device achieves a power efficiency rating of 1.5W per gigaflop, making it highly energy-efficient compared to similar products.

4. It has been certified to meet international safety and environmental standards, ensuring compliance with global regulations.

Frequently Asked Questions

Q1: Can the XCV200E-6FG256C operate reliably at extreme temperatures?

A1: Yes, the XCV200E-6FG256C is designed to function optimally between -40¡ãC and +85¡ãC, providing reliable performance across a broad temperature range.

Q2: Is there any specific hardware requirement when using the XCV200E-6FG256C?

A2: The XCV200E-6FG256C requires a compatible motherboard with sufficient PCIe slots and adequate cooling solutions to manage its heat output during operation.

Q3: In which specific scenarios would the XCV200E-6FG256C be most beneficial?

A3: The XCV200E-6FG256C excels in scenarios requiring high-speed data processing and low-latency operations, such as real-time data analysis in financial markets, autonomous vehicle navigation systems, and high-frequency trading platforms.

Other people’s search terms

– High-performance computing solution

– Energy-efficient processor

– Industrial-grade computing module

– Advanced AI processing unit

– Robust data center component

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

Important updates waiting for you!

Subscribe and grab 10% OFF!