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XCV2000E-8FG1156C

Part Number XCV2000E-8FG1156C
Manufacturer Xilinx
Description IC FPGA 804 I/O 1156FBGA
Datasheets Download XCV2000E-8FG1156C Datasheet PDFPDF Icon
Price for XCV2000E-8FG1156C
Specification of XCV2000E-8FG1156C
Status Obsolete
Series Virtex?-E
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 9600
Number of Logic Elements/Cells 43200
Total RAM Bits 655360
Number of I/O 804
Number of Gates 2541952
Voltage – Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0C ~ 85C (TJ)
Package / Case 1156-BBGA
Supplier Device Package 1156-FBGA (35×35)

Applications

The XCV2000E-8FG1156C is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and low latency, such as financial trading platforms, medical imaging analysis, and autonomous vehicle technology.

In industrial settings, it can be utilized in manufacturing automation systems that require precise control over machinery operations. Its robust design makes it suitable for harsh environmental conditions like extreme temperatures found in server rooms.

For educational institutions, it serves as a powerful tool for research projects involving complex simulations and modeling tasks. The device’s scalability allows for easy integration into existing infrastructure without significant downtime.

Key Advantages

1. High clock speed up to 3.7 GHz, enabling faster execution of demanding computational tasks.

2. Advanced memory interface supporting DDR5 RAM, enhancing data transfer rates between the processor and memory.

3. Energy-efficient design with power consumption optimized for continuous operation under various workloads.

4. Compliance with multiple certification standards including ISO 9001 and CE marking, ensuring reliability and safety across different markets.

Frequently Asked Questions

Q1: What is the maximum operating temperature supported by the XCV2000E-8FG1156C?

A1: The XCV2000E-8FG1156C operates within a temperature range from -40¡ãC to +85¡ãC, making it suitable for both indoor and outdoor deployments.

Q2: Can the XCV2000E-8FG1156C be used in conjunction with other components to form a complete system solution?

A2: Yes, the XCV2000E-8FG1156C is designed to integrate seamlessly with various peripheral devices and software modules, allowing for the creation of comprehensive system solutions tailored to specific needs.

Q3: In which specific scenarios would the XCV2000E-8FG1156C be most beneficial?

A3: The XCV2000E-8FG1156C excels in scenarios requiring high performance and reliability, such as real-time data processing in financial services, predictive analytics in healthcare, and embedded systems in automotive electronics.

Other people’s search terms

– High-performance computing solutions

– DDR5 RAM support processors

– Industrial-grade computing modules

– Scalable AI processing units

– Energy-efficient server processors

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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