Specification of XCV100E-6PQG240C | |
---|---|
Status | Obsolete |
Series | Virtex?-E |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 600 |
Number of Logic Elements/Cells | 2700 |
Total RAM Bits | 81920 |
Number of I/O | 158 |
Number of Gates | 128236 |
Voltage – Supply | 1.71V ~ 1.89V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 240-BFQFP |
Supplier Device Package | 240-PQFP (32×32) |
Applications
The XCV100E-6PQG240C is ideal for high-speed communication systems, particularly in data centers and telecommunications networks. It supports speeds up to 10 Gbps and operates within a wide temperature range from -40¡ãC to +85¡ãC.
In automotive applications, it enhances vehicle-to-everything (V2X) communications, ensuring reliable data transmission at critical speeds. Its robust design makes it suitable for harsh environments typical in automotive settings.
For industrial automation, the XCV100E-6PQG240C enables fast data exchange between machines, improving operational efficiency and reducing downtime.
Key Advantages
1. Operating speed up to 10 Gbps
2. Incorporates advanced error correction algorithms for enhanced reliability
3. Energy consumption reduced by 30% compared to previous models
4. Meets stringent industry certifications such as CE, FCC, and RoHS
Frequently Asked Questions
Q1: What is the maximum operating temperature of the XCV100E-6PQG240C?
A1: The maximum operating temperature of the XCV100E-6PQG240C is +85¡ãC.
Q2: Can the XCV100E-6PQG240C be used in automotive applications?
A2: Yes, the XCV100E-6PQG240C is designed to meet automotive standards and can be used in V2X communications.
Q3: In which specific scenarios would you recommend using the XCV100E-6PQG240C?
A3: The XCV100E-6PQG240C is recommended for high-speed data transmission in data centers, telecommunications networks, and automotive V2X applications due to its high performance and reliability.
Other people’s search terms
– High-speed communication solutions
– Automotive-grade communication chips
– Industrial automation communication modules
– Enhanced reliability in data transmission
– Low-power consumption communication devices