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XCV100E-6FG256C

Part Number XCV100E-6FG256C
Manufacturer Xilinx
Description IC FPGA 176 I/O 256FBGA
Datasheets Download XCV100E-6FG256C Datasheet PDFPDF Icon
Price for XCV100E-6FG256C
Specification of XCV100E-6FG256C
Status Obsolete
Series Virtex?-E
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 600
Number of Logic Elements/Cells 2700
Total RAM Bits 81920
Number of I/O 176
Number of Gates 128236
Voltage – Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0C ~ 85C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FBGA (17×17)

Applications

The XCV100E-6FG256C is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and storage solutions, including video encoding/decoding, big data analytics, and machine learning algorithms.

In industrial settings, it can be utilized in automation control systems, where its robust design ensures reliability under varying environmental conditions. The device operates within a wide temperature range from -40¡ãC to +85¡ãC, making it suitable for harsh climates.

For automotive applications, the XCV100E-6FG256C enhances onboard entertainment systems and advanced driver assistance features through its superior performance capabilities.

Key Advantages

1. High bandwidth support up to 10Gbps per lane, enabling faster data transfer rates.

2. Advanced error correction mechanisms that improve data integrity and reduce bit errors.

3. Energy-efficient design with low power consumption, reducing operational costs.

4. Compliance with multiple industry-standard certifications ensuring interoperability across various platforms.

Frequently Asked Questions

Q1: What is the maximum operating temperature supported by the XCV100E-6FG256C?

A1: The XCV100E-6FG256C operates effectively within a temperature range of -40¡ãC to +85¡ãC, providing reliable performance in diverse environments.

Q2: Can the XCV100E-6FG256C be used in conjunction with other components to form a complete system solution?

A2: Yes, the XCV100E-6FG256C is designed to integrate seamlessly with other hardware components, allowing for the creation of comprehensive system solutions tailored to specific application needs.

Q3: In which specific scenarios would the XCV100E-6FG256C be most beneficial?

A3: The XCV100E-6FG256C excels in scenarios requiring high-speed data transmission and processing, such as in cloud computing environments, AI model training, and real-time data analysis tasks.

Other people’s search terms

– High-bandwidth data transmission solutions

– Robust data center infrastructure components

– Automotive-grade data processing units

– Efficient data storage and retrieval systems

– Industry-standard certified data communication modules

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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