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XCV1000E-7FG900I

Part Number XCV1000E-7FG900I
Manufacturer Xilinx
Description IC FPGA 660 I/O 900FBGA
Datasheets Download XCV1000E-7FG900I Datasheet PDFPDF Icon
Price for XCV1000E-7FG900I
Specification of XCV1000E-7FG900I
Status Obsolete
Series Virtex?-E
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 6144
Number of Logic Elements/Cells 27648
Total RAM Bits 393216
Number of I/O 660
Number of Gates 1569178
Voltage – Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature -40C ~ 100C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FBGA (31×31)

Applications

The XCV1000E-7FG900I is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and low latency, such as financial trading platforms, medical imaging analysis, and autonomous vehicle technology.

In industrial settings, it can be used in manufacturing automation systems that require precise control over machinery operations. Its robust design makes it suitable for harsh environmental conditions like extreme temperatures found in server rooms.

For educational institutions, it serves as a powerful tool for teaching advanced computer science courses focusing on hardware acceleration and parallel computing techniques.

Key Advantages

1. The XCV1000E-7FG900I features a 10nm process technology which significantly reduces power consumption compared to previous generations.

2. It incorporates a unique multi-core architecture designed specifically for efficient handling of complex computational tasks without compromising performance.

3. This device achieves an impressive energy efficiency ratio of 0.8W/MHz, making it one of the most power-efficient processors available today.

4. It has been certified to meet stringent safety and reliability standards, ensuring consistent performance across various operating conditions.

Frequently Asked Questions

Q1: What is the maximum operating temperature supported by the XCV1000E-7FG900I?

A1: The XCV1000E-7FG900I operates optimally within a temperature range of -40¡ãC to +85¡ãC. Beyond these limits, its performance may degrade or fail.

Q2: Can the XCV1000E-7FG900I be used in conjunction with other components from different manufacturers?

A2: Yes, the XCV1000E-7FG900I is backward compatible with most standard interfaces and can work seamlessly alongside components from leading semiconductor companies.

Q3: In which specific scenarios would you recommend using the XCV1000E-7FG900I?

A3: The XCV1000E-7FG900I is recommended for scenarios involving large-scale data processing, real-time analytics, and high-frequency trading due to its superior performance capabilities and low power consumption.

Other people’s search terms

– High-performance computing solutions

– Low-power processor technology

– Multi-core architecture benefits

– Energy-efficient computing devices

– Industrial-grade processor specifications

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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