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XCV1000E-6FG900I

Part Number XCV1000E-6FG900I
Manufacturer Xilinx
Description IC FPGA 660 I/O 900FBGA
Datasheets Download XCV1000E-6FG900I Datasheet PDFPDF Icon
Price for XCV1000E-6FG900I
Specification of XCV1000E-6FG900I
Status Obsolete
Series Virtex?-E
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 6144
Number of Logic Elements/Cells 27648
Total RAM Bits 393216
Number of I/O 660
Number of Gates 1569178
Voltage – Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature -40C ~ 100C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FBGA (31×31)

Applications

The XCV1000E-6FG900I is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and large-scale parallel computing tasks. Key features include support for multiple memory interfaces and advanced error correction capabilities.

In industrial automation, it powers complex control systems that require precise timing and reliability. Its robust design ensures consistent performance under varying environmental conditions, making it suitable for use in harsh industrial settings.

For automotive applications, the XCV1000E-6FG900I enhances vehicle electronics, supporting advanced driver assistance systems (ADAS) and infotainment systems. It provides the necessary bandwidth and processing power for real-time data analysis and decision-making processes.

Operating Temperature: -40¡ãC to +85¡ãC

Key Advantages

1. High-bandwidth Memory Interface Support (up to 16Gbps)

2. Advanced Error Correction Code (ECC) for Data Integrity

3. Energy-efficient Design with Low Power Consumption

4. Industry-standard certifications including CE, FCC, and RoHS

Frequently Asked Questions

Q1: What is the maximum supported memory interface speed?

A1: The XCV1000E-6FG900I can support up to 16Gbps per channel, providing high-speed data transfer rates.

Q2: Is this component compatible with existing systems?

A2: Yes, the XCV1000E-6FG900I is backward-compatible with previous generations, ensuring seamless integration into existing hardware setups.

Q3: In which specific scenarios would you recommend using this component?

A3: This component is recommended for scenarios requiring high-speed data processing, such as cloud computing, AI training, and automotive electronics, due to its superior performance and reliability.

Other people’s search terms

– High-speed memory interface solutions

– Robust error correction technology

– Energy-efficient FPGA components

– Automotive-grade electronic components

– Industrial-grade data processing solutions

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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