Shopping Cart

购物车里没有产品。

XCV1000E-6FG860I

Part Number XCV1000E-6FG860I
Manufacturer Xilinx
Description IC FPGA 660 I/O 860FBGA
Datasheets Download XCV1000E-6FG860I Datasheet PDFPDF Icon
Price for XCV1000E-6FG860I
Specification of XCV1000E-6FG860I
Status Obsolete
Series Virtex?-E
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 6144
Number of Logic Elements/Cells 27648
Total RAM Bits 393216
Number of I/O 660
Number of Gates 1569178
Voltage – Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature -40C ~ 100C (TJ)
Package / Case 860-BGA Exposed Pad
Supplier Device Package 860-FBGA (42.5×42.5)

Applications

The XCV1000E-6FG860I is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and large-scale parallel computing tasks. Key features include support for multiple memory channels and advanced error correction capabilities.

In industrial automation, it powers complex control systems that require precise timing and reliability. Its robust design ensures consistent performance under varying environmental conditions, making it suitable for use in harsh industrial settings.

For automotive applications, the XCV1000E-6FG860I enhances vehicle electronics, supporting advanced driver assistance systems (ADAS) and infotainment systems. It provides the necessary bandwidth and processing power for real-time data analysis and decision-making processes.

Operating Temperature: -40¡ãC to +85¡ãC

Key Advantages

1. High-bandwidth Memory Support: The XCV1000E-6FG860I can handle up to 16Gbps per channel, enabling faster data transfer rates compared to previous generations.

2. Scalable Architecture: Its modular design allows for easy expansion and integration into existing systems without significant modifications.

3. Energy Efficiency: Equipped with advanced power management features, it consumes less energy while maintaining high performance levels.

4. Industry Certifications: The chip meets stringent safety and quality standards, ensuring reliable operation in diverse environments.

Frequently Asked Questions

Q1: What is the maximum supported memory bandwidth?

A1: The XCV1000E-6FG860I supports a maximum memory bandwidth of 16Gbps per channel.

Q2: Is this chip compatible with legacy systems?

A2: Yes, the XCV1000E-6FG860I maintains backward compatibility with older system architectures, allowing for smooth integration into new designs.

Q3: In which specific scenarios would you recommend using this chip?

A3: This chip is recommended for scenarios involving high-speed data processing, such as cloud computing, AI training, and automotive electronics, due to its superior performance and scalability.

Other people’s search terms

– High-performance computing solutions

– Advanced memory support chips

– Automotive electronics components

– Industrial automation processors

– Scalable memory interface technology

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

Important updates waiting for you!

Subscribe and grab 10% OFF!