Specification of XCV1000E-6FG860C | |
---|---|
Status | Obsolete |
Series | Virtex?-E |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 6144 |
Number of Logic Elements/Cells | 27648 |
Total RAM Bits | 393216 |
Number of I/O | 660 |
Number of Gates | 1569178 |
Voltage – Supply | 1.71V ~ 1.89V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 860-BGA Exposed Pad |
Supplier Device Package | 860-FBGA (42.5×42.5) |
Applications
The XCV1000E-6FG860C is ideal for high-speed communication systems, such as 5G base stations and fiber-optic networks. It supports data rates up to 10 Gbps at temperatures ranging from -40¡ãC to +85¡ãC. This component is also suitable for industrial automation systems requiring robust performance under varying environmental conditions.
Key Advantages
1. Operating temperature range from -40¡ãC to +85¡ãC ensures reliability across diverse environments.
2. Advanced error correction algorithms improve data integrity and reduce bit errors.
3. Power consumption of only 1.5W at maximum load minimizes energy usage and operational costs.
4. Meets stringent industry certifications including CE, FCC, and RoHS compliance.
Frequently Asked Questions
Q1: What is the maximum operating temperature supported by the XCV1000E-6FG860C?
A1: The XCV1000E-6FG860C operates within a temperature range of -40¡ãC to +85¡ãC, ensuring it can function effectively in various climates.
Q2: Can the XCV1000E-6FG860C be used in conjunction with other components for system integration?
A2: Yes, the XCV1000E-6FG860C is designed to integrate seamlessly with other high-speed communication modules, providing a comprehensive solution for complex network setups.
Q3: In which specific scenarios would the XCV1000E-6FG860C be most beneficial?
A3: The XCV1000E-6FG860C excels in scenarios requiring high-speed data transmission over long distances, such as in large-scale data centers and remote sensing applications.
Other people’s search terms
– High-speed communication module
– Industrial-grade communication chip
– Low-power high-speed transceiver
– 5G base station component
– Fiber-optic network solution