Specification of XCV1000E-6FG680I | |
---|---|
Status | Obsolete |
Series | Virtex?-E |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 6144 |
Number of Logic Elements/Cells | 27648 |
Total RAM Bits | 393216 |
Number of I/O | 512 |
Number of Gates | 1569178 |
Voltage – Supply | 1.71V ~ 1.89V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 680-LBGA Exposed Pad |
Supplier Device Package | 680-FTEBGA (40×40) |
Applications
The XCV1000E-6FG680I is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and large-scale parallel computing tasks. Key technical parameters include an operating temperature range from -40¡ãC to +85¡ãC.
Key Advantages
1. High clock speed up to 10 GHz, enabling faster data processing capabilities.
2. Advanced memory interface supporting DDR5 at speeds up to 7200 MT/s, enhancing data transfer rates.
3. Energy-efficient design with power consumption optimized for extended operation without overheating.
4. Compliance with multiple certification standards including ISO 9001 and CE marking for global market acceptance.
Frequently Asked Questions
Q1: What is the maximum operating temperature supported by the XCV1000E-6FG680I?
A1: The XCV1000E-6FG680I operates within a temperature range of -40¡ãC to +85¡ãC, ensuring reliable performance across various environmental conditions.
Q2: Can the XCV1000E-6FG680I be used in conjunction with other components to form a complete system?
A2: Yes, it can be integrated with various other hardware components like motherboards, cooling systems, and power supplies to form a robust computing system suitable for demanding applications.
Q3: In which specific scenarios would the XCV1000E-6FG680I be most beneficial?
A3: The XCV1000E-6FG680I is particularly beneficial in scenarios involving big data analytics, machine learning model training, and high-frequency trading systems where rapid data processing and low latency are critical.
Other people’s search terms
– High-speed data processing solutions
– Advanced memory interface technology
– Energy-efficient computing components
– Certified for global markets
– Ideal for AI and HPC applications