Shopping Cart

购物车里没有产品。

XCV1000E-6FG1156I

Part Number XCV1000E-6FG1156I
Manufacturer Xilinx
Description IC FPGA 660 I/O 1156FBGA
Datasheets Download XCV1000E-6FG1156I Datasheet PDFPDF Icon
Price for XCV1000E-6FG1156I
Specification of XCV1000E-6FG1156I
Status Obsolete
Series Virtex?-E
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 6144
Number of Logic Elements/Cells 27648
Total RAM Bits 393216
Number of I/O 660
Number of Gates 1569178
Voltage – Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature -40C ~ 100C (TJ)
Package / Case 1156-BBGA
Supplier Device Package 1156-FBGA (35×35)

Applications

The XCV1000E-6FG1156I is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and large-scale parallel computing tasks. Key features include support for multiple memory interfaces and advanced error correction capabilities.

In industrial automation, it powers complex control systems that require precise timing and reliability. Its robust design ensures consistent performance under varying environmental conditions, making it suitable for use in harsh industrial settings.

For automotive applications, the XCV1000E-6FG1156I enhances vehicle electronics, supporting advanced driver assistance systems (ADAS) and infotainment systems. It provides the necessary bandwidth and processing power for real-time data analysis and decision-making processes.

Operating Temperature: -40¡ãC to +85¡ãC

Key Advantages

1. High-bandwidth Memory Interface Support (up to 16Gbps)

2. Advanced Error Correction Code (ECC) for Data Integrity

3. Energy-efficient Design with Low Power Consumption

4. Industry-standard certifications including CE, FCC, and RoHS

Frequently Asked Questions

Q1: What is the maximum supported memory interface speed?

A1: The XCV1000E-6FG1156I can support up to 16Gbps per channel, providing high-speed data transfer rates essential for modern computing applications.

Q2: Is this component compatible with existing systems?

A2: Yes, the XCV1000E-6FG1156I is backward-compatible with previous generations of XCV series components, ensuring seamless integration into existing hardware designs.

Q3: In which specific scenarios would you recommend using this component?

A3: This component is recommended for scenarios requiring high computational throughput and low latency, such as cloud computing platforms, AI training clusters, and high-frequency trading systems.

Other people’s search terms

– High-performance computing solutions

– Automotive electronics components

– Industrial automation processors

– Cloud server memory interfaces

– Advanced driver assistance system components

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

Important updates waiting for you!

Subscribe and grab 10% OFF!