Specification of XCV1000-6BG560C | |
---|---|
Status | Obsolete |
Series | Virtex? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 6144 |
Number of Logic Elements/Cells | 27648 |
Total RAM Bits | 131072 |
Number of I/O | 404 |
Number of Gates | 1124022 |
Voltage – Supply | 2.375V ~ 2.625V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 560-LBGA Exposed Pad, Metal |
Supplier Device Package | 560-MBGA (42.5×42.5) |
Applications
The XCV1000-6BG560C is ideal for high-speed communication systems, particularly in data centers and telecommunications networks. It supports speeds up to 10 Gbps and operates within a wide temperature range from -40¡ãC to +85¡ãC.
In automotive applications, it enhances vehicle-to-everything (V2X) communications, ensuring reliable data transmission at critical speeds. Its robust design makes it suitable for harsh environments found in automotive settings.
Industrial automation systems benefit from its precision timing capabilities, enabling synchronized operations across large-scale machinery. The device also finds application in medical imaging equipment, providing high-resolution image processing without compromising performance.
Key Advantages
1. Operating speed of up to 10 Gbps, making it suitable for high-bandwidth applications.
2. Incorporates a unique multi-channel architecture that optimizes data flow and reduces latency.
3. Achieves power consumption of less than 1W per channel under typical operating conditions, enhancing energy efficiency.
4. Meets stringent industrial standards such as IEC 61000-4-2 and CE marking, ensuring reliability and safety.
Frequently Asked Questions
Q1: Can the XCV1000-6BG560C operate effectively in extreme temperatures?
A1: Yes, it can function reliably between -40¡ãC and +85¡ãC due to its advanced thermal management features.
Q2: Is there a specific version of the XCV1000-6BG560C designed for automotive applications?
A2: Yes, there is a variant optimized for automotive environments, which includes enhanced electromagnetic interference (EMI) protection and vibration resistance.
Q3: How does the XCV1000-6BG560C ensure data integrity in high-speed communications?
A3: It uses advanced error correction algorithms and redundant pathways to maintain data integrity even under high-speed conditions.
Other people’s search terms
– High-speed communication solutions
– Automotive-grade communication chips
– Industrial-grade data transmission devices
– Precision timing in automation systems
– Medical imaging equipment enhancements