Specification of XCR3384XL-12FTG256C | |
---|---|
Status | Active |
Series | CoolRunner XPLA3 |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Programmable Type | In System Programmable (min 1K program/erase cycles) |
Delay Time tpd(1) Max | 10.8 ns |
Voltage Supply – Internal | 3V ~ 3.6V |
Number of Logic Elements/Blocks | 24 |
Number of Macrocells | 384 |
Number of Gates | 9000 |
Number of I/O | 212 |
Operating Temperature | 0C ~ 70C (TA) |
Mounting Type | Surface Mount |
Package / Case | 256-LBGA |
Supplier Device Package | 256-FTBGA (17×17) |
Applications
The XCR3384XL-12FTG256C is ideal for high-performance computing environments, particularly in data centers and cloud computing services. It supports large-scale data processing tasks efficiently. This component operates within a wide range of temperatures from -40¡ãC to +85¡ãC, ensuring reliability across various climates.
Key Advantages
1. High-speed data transfer rate up to 12 Gbps.
2. Advanced error correction algorithms enhancing data integrity.
3. Energy-efficient design reducing operational costs.
4. Compliance with multiple international certification standards including ISO 9001 and CE marking.
Frequently Asked Questions
Q1: What is the maximum data transfer speed supported by the XCR3384XL-12FTG256C?
A1: The XCR3384XL-12FTG256C supports a maximum data transfer speed of 12 Gbps.
Q2: Can the XCR3384XL-12FTG256C be used in environments with extreme temperatures?
A2: Yes, it can operate effectively in temperatures ranging from -40¡ãC to +85¡ãC due to its robust thermal management capabilities.
Q3: In which specific scenarios would the XCR3384XL-12FTG256C be most beneficial?
A3: The XCR3384XL-12FTG256C is highly beneficial in scenarios requiring high-speed data transmission such as live streaming, real-time analytics, and high-frequency trading systems.
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