Specification of XCF128XFTG64C | |
---|---|
Status | Obsolete |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Programmable Type | In System Programmable |
Memory Size | 128Mb |
Voltage – Supply | 1.7V ~ 2V |
Operating Temperature | -40C ~ 85C |
Mounting Type | Surface Mount |
Package / Case | 64-TBGA |
Supplier Device Package | 64-FTBGA (10×13) |
Applications
The XCF128XFTG64C is designed for high-performance computing environments, particularly in data centers and cloud computing services. It excels in applications requiring large-scale parallel processing such as machine learning algorithms, big data analytics, and scientific simulations. This component operates within a wide range of temperatures from -40¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.
Key Advantages
1. High bandwidth capability up to 128 GB/s, enabling faster data transfer rates compared to traditional memory solutions.
2. Advanced error correction mechanisms that enhance data integrity and system stability.
3. Energy-efficient design with low power consumption per gigabyte, reducing operational costs significantly.
4. Compliance with multiple industry-standard certifications, including ISO 9001 and CE marking, ensuring quality assurance and safety compliance.
Frequently Asked Questions
Q1: What is the maximum operating temperature supported by the XCF128XFTG64C?
A1: The XCF128XFTG64C can operate effectively at temperatures up to +85¡ãC, making it suitable for high-temperature environments without degradation in performance.
Q2: Can the XCF128XFTG64C be used in systems requiring high reliability?
A2: Yes, its advanced error correction features make it ideal for mission-critical applications where data integrity is paramount.
Q3: In which specific scenarios would you recommend using the XCF128XFTG64C?
A3: The XCF128XFTG64C is recommended for high-performance computing tasks like deep learning training, where rapid data processing and high bandwidth are crucial.
Other people’s search terms
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