Specification of XC7VX330T-3FFG1157E | |
---|---|
Status | Active |
Series | Virtex?-7 XT |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 25500 |
Number of Logic Elements/Cells | 326400 |
Total RAM Bits | 27648000 |
Number of I/O | 600 |
Number of Gates | – |
Voltage – Supply | 0.97V ~ 1.03V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 1156-BBGA, FCBGA |
Supplier Device Package | 1157-FCBGA (35×35) |
Applications
The XC7VX330T-3FFG1157E is ideal for high-performance computing environments due to its robust processing capabilities. It excels in fields such as artificial intelligence training, big data analytics, and scientific simulations. This device operates within a wide temperature range from -40¡ãC to +85¡ãC, making it suitable for various industrial settings.
Key Advantages
1. High clock speed up to 600 MHz, enabling faster processing tasks.
2. Advanced memory interface supporting DDR4 RAM for enhanced data throughput.
3. Low power consumption per gigaflop, reducing operational costs significantly.
4. Compliance with multiple industry certifications ensuring reliability and safety.
Frequently Asked Questions
Q1: Can this device handle deep learning models?
A1: Yes, the XC7VX330T-3FFG1157E supports deep learning frameworks and can efficiently process large neural networks.
Q2: Is this device compatible with legacy systems?
A2: The device maintains backward compatibility with older software versions but requires updated drivers for optimal performance.
Q3: In which specific scenarios would you recommend using this XC7VX330T-3FFG1157E?
A3: This device is recommended for cloud-based AI services, edge computing in IoT devices, and high-speed data encryption applications.
Other people’s search terms
– High-performance computing solutions
– Artificial intelligence hardware
– Scientific simulation accelerators
– DDR4 memory support in FPGA
– Low-power FPGAs for AI