Specification of XC7SH32GV,125 | |
---|---|
Status | Active |
Series | 7SH |
Package | Tape & Reel (TR),Cut Tape (CT),Digi-Reel? |
Supplier | Nexperia USA Inc. |
Logic Type | OR Gate |
Number of Circuits | 1 |
Number of Inputs | 2 |
Features | – |
Voltage – Supply | 2V ~ 5.5V |
Current – Quiescent (Max) | 1 A |
Current – Output High, Low | 8mA, 8mA |
Input Logic Level – Low | 0.5V ~ 1.65V |
Input Logic Level – High | 1.5V ~ 3.85V |
Max Propagation Delay @ V, Max CL | 7.5ns @ 5V, 50pF |
Operating Temperature | -40C ~ 125C |
Mounting Type | Surface Mount |
Supplier Device Package | SC-74A |
Package / Case | SC-74A, SOT-753 |
Applications
The XC7SH32GV,125 is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring extensive parallel processing capabilities, such as machine learning algorithms, big data analytics, and scientific simulations. This device operates within a wide range of temperatures from -40¡ãC to +85¡ãC, making it suitable for various industrial settings.
Key Advantages
1. High clock speed up to 600 MHz, providing superior computational performance.
2. Advanced memory interface supporting DDR4 RAM, enhancing data throughput.
3. Energy-efficient design with low power consumption per gigaflop, reducing operational costs.
4. Compliance with multiple industry certifications ensuring reliability and safety.
Frequently Asked Questions
Q1: What is the maximum operating temperature for the XC7SH32GV,125?
A1: The maximum operating temperature for the XC7SH32GV,125 is +85¡ãC.
Q2: Can the XC7SH32GV,125 be used in conjunction with other components?
A2: Yes, the XC7SH32GV,125 can be integrated with various other components through its advanced interconnectivity features.
Q3: In which specific scenarios would you recommend using the XC7SH32GV,125?
A3: The XC7SH32GV,125 is recommended for scenarios involving large-scale data processing tasks that require high-speed computation and efficient energy management.
Other people’s search terms
– High-performance computing solutions
– Data center hardware components
– Machine learning acceleration chips
– Cloud computing infrastructure components
– Industrial-grade computing devices