Specification of XC7S75-L1FGGA676I | |
---|---|
Status | Active |
Series | Spartan?-7 |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 6000 |
Number of Logic Elements/Cells | 76800 |
Total RAM Bits | 4331520 |
Number of I/O | 400 |
Number of Gates | – |
Voltage – Supply | 0.92V ~ 0.98V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 676-BGA |
Supplier Device Package | 676-FPBGA (27×27) |
Applications
The XC7S75-L1FGGA676I is ideal for high-performance computing environments due to its robust processing capabilities. It excels in applications such as data centers, cloud computing services, and artificial intelligence training models. This device supports operations at temperatures ranging from -40¡ãC to +85¡ãC, ensuring reliability across various climates.
Key Advantages
1. High clock speed up to 100 MHz
2. Advanced memory interface supporting DDR4
3. Energy-efficient design with low power consumption
4. Compliance with industry-standard certifications like ISO 9001 and CE Marking
Frequently Asked Questions
Q1: Can the XC7S75-L1FGGA676I operate effectively in extreme temperatures?
A1: Yes, it operates within a wide temperature range from -40¡ãC to +85¡ãC, making it suitable for both indoor and outdoor applications.
Q2: What kind of memory interfaces does this device support?
A2: The XC7S75-L1FGGA676I supports DDR4 memory interfaces, enhancing data transfer rates and performance.
Q3: In which specific scenarios would you recommend using the XC7S75-L1FGGA676I?
A3: This device is recommended for high-speed data processing tasks, AI model training, and cloud-based applications that require efficient and reliable hardware.
Other people’s search terms
– High-performance computing solutions
– DDR4 memory interface devices
– Temperature-resistant FPGA processors
– Energy-efficient computing components
– Industry-standard certified FPGAs